Browsing by author "Podprocky, T."
Now showing items 1-3 of 3
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High density flip chip with adhesives on ceramics
Vandecasteele, Bjorn; Podprocky, T.; Vanfleteren, Jan (2002) -
Low cost wide temperature range adhesive flip-chip technology using a combination of ICA and NCA
Vanfleteren, Jan; Vandecasteele, Bjorn; Podprocky, T. (2002) -
Low temperature flip-chip process using ICA and NCA (isotropivally and non-conductive adhesive) for flexible displays application
Vanfleteren, Jan; Vandecasteele, Bjorn; Podprocky, T. (2002)