Browsing by author "Sleeckx, Erik"
Now showing items 61-79 of 79
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Overview on recent improvement for industrially applicable PERL-type Si solar cell processing
Horzel, Jörg; Choulat, Patrick; Cornagliotti, Emanuele; Janssens, Tom; John, Joachim; Kuzma Filipek, Izabela; Prajapati, Victor; Rothschild, Aude; Russell, Richard; Singh, Sukhvinder; Sleeckx, Erik; Tous, Loic; Uruena De Castro, Angel; Vermang, Bart; Ngamo, Michel; Jaffrennou, Perine; Penaud, Julien; Duerinckx, Filip; Cacciato, Antonio; Poortmans, Jef (2012) -
Performance improvement of tall triple gate devices with strained SiN layers
Collaert, Nadine; De Keersgieter, An; Kottantharayil, Anil; Rooyackers, Rita; Eneman, Geert; Goodwin, Michael; Eyckens, Brenda; Sleeckx, Erik; de Marneffe, Jean-Francois; De Meyer, Kristin; Absil, Philippe; Jurczak, Gosia; Biesemans, Serge (2005-11) -
Polymer and bump planarization for fine pitch micro-bump stacking
Inoue, Fumihiro; Derakhshandeh, Jaber; Moeller, Berthold; Gokita, Yohei; Duval, Fabrice; Bex, Pieter; Capuz, Giovanni; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2018) -
Pre-bonding characterization of SiCN enabled wafer stacking
Peng, Lan; Kim, Soon-Wook; Iacovo, Serena; Inoue, Fumihiro; De Vos, Joeri; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Process optimization and integration of trimethylsilane deposited a-SiC:H and SiOC:H dielectric thin films for damascene processing
Gray, William; Loboda, M.; Struyf, Herbert; Van Hove, Marleen; Donaton, R. A.; Sleeckx, Erik; Stucchi, Michele; Gao, Teng; Boullart, Werner; Coenegrachts, Bart; Maenhoudt, Mireille; Vanhaelemeersch, Serge; Meynen, Herman; Maex, Karen (2000) -
Process optimization and integration of trimethylsilane-deposited a-SiC:H and a-SiCO:H dielectric thin films for damascene processing
Gray, W.D.; Loboda, M.J.; Bremmer, J.N.; Struyf, Herbert; Lepage, Muriel; Van Hove, Marleen; Alves Donaton, Ricardo; Sleeckx, Erik; Stucchi, Michele; Lanckmans, Filip; Gao, Teng; Boullart, Werner; Coenegrachts, Bart; Maenhoudt, Mireille; Vanhaelemeersch, Serge; Meynen, H.; Maex, Karen (2003) -
Process optimization of low temperature silicon nitride stressor layers for improvement of device performance for 45nm technology and below
Eyckens, Brenda; Collaert, Nadine; Schaekers, Marc; Sleeckx, Erik; Eneman, Geert; Verheyen, Peter; Rooyackers, Rita (2005) -
Properties of porous HSQ-based films capped by plasma enhanced chemical vapor deposition dielectric layers
Iacopi, Francesca; Baklanov, Mikhaïl; Sleeckx, Erik; Conrad, T.; Bender, Hugo; Meynen, Herman; Maex, Karen (2002) -
Quasi-non volatile flatband-voltage shift in metal-oxide-semiconductor capacitors with silicon-rich-oxide dielectric
Rosmeulen, Maarten; Sleeckx, Erik; De Meyer, Kristin (2001) -
Self aligned CuGeN process for 32/22nm nodes and beyond
Liu, C.S.; Chen, H.C.; Bao, T.I.; Van Olmen, Jan; Croes, Kristof; Van Besien, Els; Pantouvaki, Marianna; Zhao, Chao; Sleeckx, Erik; Beyer, Gerald; Yu, C.H. (2008) -
Silicon-rich oxides as an alternative charge-trapping medium in Fowler-Nordheim and hot-carrier type non-volatile-memory cells
Rosmeulen, Maarten; Sleeckx, Erik; De Meyer, Kristin (2002) -
Studies and optimization of HfO2 grown by HfCl4/H2O atomic layer deposition
Delabie, Annelies; Caymax, Matty; Brijs, Bert; Brunco, David; Conard, Thierry; Sleeckx, Erik; Ragnarsson, Lars-Ake; Van Elshocht, Sven; De Gendt, Stefan; Heyns, Marc (2005) -
The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics
Phommahaxay, Alain; Guerrero, Alice; Kennes, Koen; Podpod, Arnita; Brems, Steven; Slabbekoorn, John; Tussing, Sebastian; Spiess, Walter; Penger, Luke; Yess, Kim; Arnold, Kim; Rapps, Thomas; Lutter, Stefan; Sleeckx, Erik; Huyghebaert, Cedric; Asselberghs, Inge; Miller, Andy; Beyer, Gerald; Radu, Iuliana; Beyne, Eric (2019) -
Thermal compression bonding: understanding heat transfer by in situ measurement and modeling
Bex, Pieter; Wang, Teng; Cherman, Vladimir; Lofrano, Melina; Capuz, Giovanni; Sleeckx, Erik; Beyne, Eric (2017) -
Thermal desorption issues related to silicidation and back-end metallization
Li, H.; Vereecke, Guy; Schaekers, Marc; Baklanov, Mikhaïl; Sleeckx, Erik; Maex, Karen; Froyen, L. (1999) -
Thermal desorption issues related to silicidation and back-end metallization
Li, Hua; Vereecke, Guy; Schaekers, Marc; Baklanov, Mikhaïl; Sleeckx, Erik; Maex, Karen; Froyen, L. (2000) -
Ultra-low warpage epoxy mold compound for fan-out wafer level package applications
Duval, Fabrice; Podpod, Arnita; Salahouelhadj, Abdellah; Phommahaxay, Alain; Bertheau, Julien; Rebibis, Kenneth June; Sleeckx, Erik; Beyne, Eric (2018) -
Understanding improved TANOS retention by material analysis of the SixNy trapping layer
Rothschild, Aude; Van den Bosch, Geert; Breuil, Laurent; Cacciato, Antonio; Dekkers, Harold; Sleeckx, Erik; Conard, Thierry; Brijs, Bert; Kittl, Jorge (2008) -
W2W permanent stacking for 3D system integration
Peng, Lan; Kim, Soon-Wook; Soules, Michael; Gabriel, Markus; Zoberbier, Margarete; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyne, Eric (2014)