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Foreword to the special Issue on Hyperspectral remote sensing and imaging spectroscopy

Prasad, Saurabh; Liao, Wenzhi; He, Mingyi; Chanussot, Jocelyn (2018)

Morphology-dependent pH-responsiver elease of hydrophilic payloads using biodegradable nanocarriers

Pramanik, Sumit; Seneca, Senne; Peters, Martijn; D'Olieslaeger, Lien; Reekmans, Gunter; Vanderzande, Dirk; Adriaensens, Peter; Ethirajan, Anitha (2018)

Diffusion kurtosis imaging allows the early detection and longitudinal follow-up of amyloid- $b-induced pathology.

Praet, J.; Manyakov, N.V.; Muchene, L.; Mai, Z; Terzopoulos, V; de Backer, S; Torremans, A.; Guns, PJ; Van De Casteele, T; Bottelbergs, A; Van Broeck, B; Sijbers, Jan; Smeets, D.; Shkedy, Z.; Bijnens, L.; Pemberton, D.J.; Schmidt, M.E.; Van der Linden, A.; Verhoye, M. (2018)

Fast, low-volume and sensitive quantitative amplification of HCV RNA in a silicon microreactor

Powell, Laura; Wiederkehr, Rodrigo Sergio; Fauvart, Maarten; Buja, Federico; Stakenborg, Tim; Fiorini, Paolo; Ray, Stuart; Osburn, William (2018)

Rapid and sensitive detection of viral nucleic acids using silicon microchips

Powell, Laura; Wiederkehr, Rodrigo Sergio; Damascus, Paige; Fauvart, Maarten; Buja, Federico; Stakenborg, Tim; Ray, Stuart; Fiorini, Paolo; Osburn, William (2018)

Highly nondegenerate two-photon absorption in silicon wire waveguides

Poulvallarie, Nicolas; Ciret, Charles; Kuyken, Bart; Leo, Francois; Gorza, Simon-Pierre (2018-08)

An industry-ready 200 mm p-GaN E-mode GaN-on-Si power technology

Posthuma, Niels; You, Shuzhen; Stoffels, Steve; Wellekens, Dirk; Liang, Hu; Zhao, Ming; De Jaeger, Brice; Geens, Karen; Ronchi, Nicolo; Decoutere, Stefaan; Moens, Peter; Banerjee, Abhishek; Ziad, Hocine; Tack, Marnix (2018)

Gate architecture design for enhancement mode p-GaN gate HEMTs for 200 and 650V applications

Posthuma, Niels; You, Shuzhen; Stoffels, Steve; Liang, Hu; Zhao, Ming; Decoutere, Stefaan (2018)

A new method to fabricate Ge nanowires: selective lateral etching of GeSn:P-Ge multi-stacks

Porret, Clément; Vohra, Anurag; Sebaai, Farid; Douhard, Bastien; Hikavyy, Andriy; Loo, Roger (2018)

Ga-doped Ge and [B + Ga] Co-doped SiGe epitaxial source-drain for Sub-7 nm logic devices

Porret, Clément; Margetis, Joe; Tolle, John; Sammak, Amir; Scappucci, Giordano; Petersen Barbosa Lima, Lucas; Kohen, David; Kunert, Bernardette; Hikavyy, Andriy; Loo, Roger (2018)

Very low temperature epitaxy of group-IV semiconductors for use in FinFET, stacked nanowires and monolithic 3D integration

Porret, Clément; Hikavyy, Andriy; Gomez Granados, Juan Fernando; Baudot, Sylvain; Vohra, Anurag; Kunert, Bernardette; Douhard, Bastien; Bogdanowicz, Janusz; Schaekers, Marc; Kohen, David; Margetis, Joe; Tolle, John; Petersen Barbosa Lima, Lucas; Sammak, Amir; Scappucci, Giordano; Rosseel, Erik; Langer, Robert; Loo, Roger (2018)

Very low temperature epitaxy of group-IV semiconductors for use in finFET, stacked nanowires and monolithic 3D integration

Porret, Clément; Hikavyy, Andriy; Gomez Granados, Juan Fernando; Baudot, Sylvain; Vohra, Anurag; Kunert, Bernardette; Douhard, Bastien; Bogdanowicz, Janusz; Schaekers, Marc; Kohen, David; Margetis, Joe; Tolle, John; Petersen Lima, Lucas; Sammak, Amir; Scappucci, Giordano; Rosseel, Erik; Langer, Robert; Loo, Roger (2018)

imec Publications: Recent submissions

Foreword to the special Issue on Hyperspectral remote sensing and imaging spectroscopy

Morphology-dependent pH-responsiver elease of hydrophilic payloads using biodegradable nanocarriers

Diffusion kurtosis imaging allows the early detection and longitudinal follow-up of amyloid- $b-induced pathology.

Fast, low-volume and sensitive quantitative amplification of HCV RNA in a silicon microreactor

Rapid and sensitive detection of viral nucleic acids using silicon microchips

Highly nondegenerate two-photon absorption in silicon wire waveguides

An industry-ready 200 mm p-GaN E-mode GaN-on-Si power technology

Gate architecture design for enhancement mode p-GaN gate HEMTs for 200 and 650V applications

A new method to fabricate Ge nanowires: selective lateral etching of GeSn:P-Ge multi-stacks

Ga-doped Ge and [B + Ga] Co-doped SiGe epitaxial source-drain for Sub-7 nm logic devices

Very low temperature epitaxy of group-IV semiconductors for use in FinFET, stacked nanowires and monolithic 3D integration

Very low temperature epitaxy of group-IV semiconductors for use in finFET, stacked nanowires and monolithic 3D integration

High-performance (EOT<0.4nm, Jg~10-7A/cm2) ALD-deposited Ru\SrTiO3 stack for next generations DRAM pillar capacitor

Multi trigger resist for EUV lithography

Structured inference networks using high-dimensional sensors for surveillance purposes

Intrasubject multimodal groupwise registration with the conditional template entropy

High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package

A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch

TDoA-based outdoor positioning in a public LoRa network

TDoA-based outdoor positioning with tracking algorithm in a public LoRa network

imec Publications: Recent submissions

Foreword to the special Issue on Hyperspectral remote sensing and imaging spectroscopy ﻿

Morphology-dependent pH-responsiver elease of hydrophilic payloads using biodegradable nanocarriers ﻿

Diffusion kurtosis imaging allows the early detection and longitudinal follow-up of amyloid- $b-induced pathology. ﻿

Fast, low-volume and sensitive quantitative amplification of HCV RNA in a silicon microreactor ﻿

Rapid and sensitive detection of viral nucleic acids using silicon microchips ﻿

Highly nondegenerate two-photon absorption in silicon wire waveguides ﻿

An industry-ready 200 mm p-GaN E-mode GaN-on-Si power technology ﻿

Gate architecture design for enhancement mode p-GaN gate HEMTs for 200 and 650V applications ﻿

A new method to fabricate Ge nanowires: selective lateral etching of GeSn:P-Ge multi-stacks ﻿

Ga-doped Ge and [B + Ga] Co-doped SiGe epitaxial source-drain for Sub-7 nm logic devices ﻿

Very low temperature epitaxy of group-IV semiconductors for use in FinFET, stacked nanowires and monolithic 3D integration ﻿

Very low temperature epitaxy of group-IV semiconductors for use in finFET, stacked nanowires and monolithic 3D integration ﻿

High-performance (EOT<0.4nm, Jg~10-7A/cm2) ALD-deposited Ru\SrTiO3 stack for next generations DRAM pillar capacitor ﻿

Multi trigger resist for EUV lithography ﻿

Structured inference networks using high-dimensional sensors for surveillance purposes ﻿

Intrasubject multimodal groupwise registration with the conditional template entropy ﻿

High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package ﻿

A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch ﻿

TDoA-based outdoor positioning in a public LoRa network ﻿

TDoA-based outdoor positioning with tracking algorithm in a public LoRa network ﻿

Foreword to the special Issue on Hyperspectral remote sensing and imaging spectroscopy

Morphology-dependent pH-responsiver elease of hydrophilic payloads using biodegradable nanocarriers

Diffusion kurtosis imaging allows the early detection and longitudinal follow-up of amyloid- $b-induced pathology.

Fast, low-volume and sensitive quantitative amplification of HCV RNA in a silicon microreactor

Rapid and sensitive detection of viral nucleic acids using silicon microchips

Highly nondegenerate two-photon absorption in silicon wire waveguides

An industry-ready 200 mm p-GaN E-mode GaN-on-Si power technology

Gate architecture design for enhancement mode p-GaN gate HEMTs for 200 and 650V applications

A new method to fabricate Ge nanowires: selective lateral etching of GeSn:P-Ge multi-stacks

Ga-doped Ge and [B + Ga] Co-doped SiGe epitaxial source-drain for Sub-7 nm logic devices

Very low temperature epitaxy of group-IV semiconductors for use in FinFET, stacked nanowires and monolithic 3D integration

Very low temperature epitaxy of group-IV semiconductors for use in finFET, stacked nanowires and monolithic 3D integration

High-performance (EOT<0.4nm, Jg~10-7A/cm2) ALD-deposited Ru\SrTiO3 stack for next generations DRAM pillar capacitor

Multi trigger resist for EUV lithography

Structured inference networks using high-dimensional sensors for surveillance purposes

Intrasubject multimodal groupwise registration with the conditional template entropy

High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package

A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch

TDoA-based outdoor positioning in a public LoRa network

TDoA-based outdoor positioning with tracking algorithm in a public LoRa network