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Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
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Authors
Iacovo, Serena
;
Peng, Lan
;
Nagano, Fuya
;
Uhrmann, Thomas
;
Burggraf, Jurgen
;
Fehkuhrer, Andreas
;
Conard, Thierry
;
Inoue, Fumihiro
;
Kim, Soon-Wook
;
De Vos, Joeri
;
Phommahaxay, Alain
;
Beyne, Eric
DOI
10.1109/ECTC32696.2021.00330
EISBN
978-0-7381-4523-5
ISSN
0569-5503
Conference
IEEE 71st Electronic Components and Technology Conference (ECTC)
Journal
na
Title
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Publication type
Proceedings paper
Embargo date
9999-12-31
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Date
Summary
3
20.500.12860/37432.3
*
2022-04-25T09:51:54Z
validation by library/open access desk
2
20.500.12860/37432.2
2022-03-29T08:08:43Z
validation by imec author
1
20.500.12860/37432
2021-11-02T15:55:03Z
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