Recently added

Alternative EUV materials. Status at imec

De Simone, Danilo (2015)

XAS photoresists electron/quantum yields study with synchrotron light

De Schepper, Peter; Vaglio Pret, Alessandro; Hansen, Terje; Giglia, Angelo; Hoshiko, Kenji; Mani, Antonio; Biafore, John J. (2015)

Ar and H2 plasma and neutral/ion beam treatment of EUV resist

De Schepper, Peter; Marinov, Daniil; El Otell, Ziad; Altamirano Sanchez, Efrain; de Marneffe, Jean-Francois; De Gendt, Stefan; Braithwaite, Nicholas St. J. (2015-03)

Active pixel concepts for high-resolution large-area imagers

De Roose, Florian; Steudel, Soeren; Malinowski, Pawel; Myny, Kris; Xhakoni, Adi; Gielen, Georges; Genoe, Jan; Dehaene, Wim (2015)

Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications

De Preter, Inge; Derakhshandeh, Jaber; Heylen, Nancy; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015)

Goals and directions of the newly started EXIST project

De Moor, Piet; Lambrechts, Andy; Borremans, Jonathan; Dutta, Barundeb (2015)

IMEC's offering for space imagers

De Moor, Piet (2015)

Impact of oxide liner properties on TSV Cu pumping and TSV stress

De Messemaeker, Joke; Varela Pedreira, Olalla; Moussa, Alain; Nabiollahi, Nabi; Vanstreels, Kris; Van Huylenbroeck, Stefaan; Philipsen, Harold; Verdonck, Patrick; Vandevelde, Bart; De Wolf, Ingrid; Beyne, Eric; Croes, Kristof (2015)

Optimized pore stuffing for enhanced compatibility with interconnect integration flow

de Marneffe, Jean-Francois; Zhang, Liping; Rutigliani, Vito; Noya, G.; Cao, Yi; Lesniewska, Alicja; Varela Pedreira, Olalla; Croes, Kristof; Gillot, Christophe; Tokei, Zsolt; Boemmels, Juergen; Baklanov, Mikhaïl (2015)

Single nanometer pattern transfer

de Marneffe, Jean-Francois; Cooke, Mike; Neuber, Christian (2015)

56+ Gb/s serial transmission using duo-binary signaling

De Keulenaer, Timothy; De Geest, Jan; Torfs, Guy; Bauwelinck, Johan; Ban, Yu; Sinsky, Jeffrey; Kozicki, Bartek (2015)

A new look on the properties of oxygen vacancies in a-IGZO

de Jamblinne de Meux, Albert; Pourtois, Geoffrey; Genoe, Jan; Heremans, Paul (2015)

A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes

De Groote, Andreas; Cardile, Paul; Subramanian, Ananth; Tassaert, Martijn; Delbeke, Danaë; Baets, Roel; Roelkens, Gunther (2015)

IoT: the Impact of Things

De Boeck, Jo (2015)

OPC: a cross road of data flows

De Bisschop, Peter (2015)

Understanding of Out-of-Band DUV light in EUV lithography: controlling impact on imaging and mitigation strategies

Davydova, Natalia; Kottumakulal, Ram; Hageman, J.; McNamara, J.; Hoefnagels, Rik; Vaenkatesan, V.; van Dijk, Andre; Ricken, K.; de Winter, L.; De Kruif, Robert; Jonckheere, Rik; Hollink, T.; Schiffelers, Guido; van Setten, Eelco; Colsters, P.; Liebregts, W.; Pellens1, Rudy; van Dijk, Joep (2015)

Conference contributions: Recent submissions

Alternative EUV materials. Status at imec

XAS photoresists electron/quantum yields study with synchrotron light

Ar and H2 plasma and neutral/ion beam treatment of EUV resist

Active pixel concepts for high-resolution large-area imagers

Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications

Goals and directions of the newly started EXIST project

IMEC's offering for space imagers

Impact of oxide liner properties on TSV Cu pumping and TSV stress

Optimized pore stuffing for enhanced compatibility with interconnect integration flow

Single nanometer pattern transfer

56+ Gb/s serial transmission using duo-binary signaling

A new look on the properties of oxygen vacancies in a-IGZO

A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes

IoT: the Impact of Things

OPC: a cross road of data flows

Understanding of Out-of-Band DUV light in EUV lithography: controlling impact on imaging and mitigation strategies

Octave spanning supercontinuum generation in InGaP waveguides on a silicon substrate at 1550 nm

3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly

Liquid crystal beam steering components for display applications

Reliability mechanisms and lifetime extrapolation methods for scaled interconnect technologies

Conference contributions: Recent submissions

Alternative EUV materials. Status at imec ﻿

XAS photoresists electron/quantum yields study with synchrotron light ﻿

Ar and H2 plasma and neutral/ion beam treatment of EUV resist ﻿

Active pixel concepts for high-resolution large-area imagers ﻿

Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications ﻿

Goals and directions of the newly started EXIST project ﻿

IMEC's offering for space imagers ﻿

Impact of oxide liner properties on TSV Cu pumping and TSV stress ﻿

Optimized pore stuffing for enhanced compatibility with interconnect integration flow ﻿

Single nanometer pattern transfer ﻿

56+ Gb/s serial transmission using duo-binary signaling ﻿

A new look on the properties of oxygen vacancies in a-IGZO ﻿

A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes ﻿

IoT: the Impact of Things ﻿

OPC: a cross road of data flows ﻿

Understanding of Out-of-Band DUV light in EUV lithography: controlling impact on imaging and mitigation strategies ﻿

Octave spanning supercontinuum generation in InGaP waveguides on a silicon substrate at 1550 nm ﻿

3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly ﻿

Liquid crystal beam steering components for display applications ﻿

Reliability mechanisms and lifetime extrapolation methods for scaled interconnect technologies ﻿

Alternative EUV materials. Status at imec

XAS photoresists electron/quantum yields study with synchrotron light

Ar and H2 plasma and neutral/ion beam treatment of EUV resist

Active pixel concepts for high-resolution large-area imagers

Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications

Goals and directions of the newly started EXIST project

IMEC's offering for space imagers

Impact of oxide liner properties on TSV Cu pumping and TSV stress

Optimized pore stuffing for enhanced compatibility with interconnect integration flow

Single nanometer pattern transfer

56+ Gb/s serial transmission using duo-binary signaling

A new look on the properties of oxygen vacancies in a-IGZO

A waveguide coupled LED on SOI by heterogeneous integration of InP-based membranes

IoT: the Impact of Things

OPC: a cross road of data flows

Understanding of Out-of-Band DUV light in EUV lithography: controlling impact on imaging and mitigation strategies

Octave spanning supercontinuum generation in InGaP waveguides on a silicon substrate at 1550 nm

3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly

Liquid crystal beam steering components for display applications

Reliability mechanisms and lifetime extrapolation methods for scaled interconnect technologies