Recently added

Solid composite electrolyte thin-films for lithium ion batteries

Chen, Xubin; Vereecken, Philippe (2015)

Directed self-assembly of PS-b-PMMA with ionic liquid addition

Chen, Xuanxuan; Nealey, Paul; Rincon Delgadillo, Paulina; Gronheid, Roel; Seo, Takehito; Matsumiya, Tasuku; Ohmori, Katsumi; Maehashi, Takaya; Kawaue, Akiya (2015)

VFTLP characteristics of ESD protection diodes in advanced bulk FinFET technology

Chen, Shih-Hung; Linten, Dimitri; Scholz, Mirko; Hellings, Geert; Boschke, Roman; Groeseneken, Guido; Thean, Aaron (2015)

ESD characterization of gate-all-around (GAA) Si nanowire devices

Chen, Shih-Hung; Hellings, Geert; Linten, Dimitri; Veloso, Anabela; Scholz, Mirko; Boschke, Roman; Groeseneken, Guido; Thean, Aaron (2015)

Engineering of a TiN\Al2O3\(Hf,Al)O2\Ta2O5\Hf RRAM cell for fast operation at low current

Chen, Michael; Goux, Ludovic; Fantini, Andrea; Degraeve, Robin; Redolfi, Augusto; Groeseneken, Guido; Jurczak, Gosia (2015)

Programming-conditions solutions towards suppression of retention tails of scaled oxide-based RRAM

Chen, Michael; Fantini, Andrea; Goux, Ludovic; Degraeve, Robin; Clima, Sergiu; Redolfi, Augusto; Groeseneken, Guido; Jurczak, Gosia (2015-12)

IIIV/ hybrid integrated devices for optical interconnect

Chen, K.; Zhu, Yuntao; Chen, Jianxin; Huang, Q.; Fu, Xin; Zhang, Jianhao; Shi, Yaocheng; Liu, J.; Roelkens, Gunther; Liu, Liu (2015)

Low-voltage waveguide Ge APD based high sensitivity 10Gb/s Si photonic receiver

Chen, Hongtao; Verheyen, Peter; Rakowski, M.; De Heyn, Peter; Lepage, Guy; De Coster, Jeroen; Absil, Philippe; Roelkens, Gunther; Van Campenhout, Joris (2015)

Sub-5V germanium waveguide avalanche photodiode based 25 Gb/s 1310 nm optical receiver

Chen, Hongtao; Verbist, Jochem; Verheyen, Peter; De Heyn, Peter; Lepage, Guy; De Coster, Jeroen; Absil, Philippe; Moeneclaey, Bart; Yin, Xin; Bauwelinck, Johan; Van Campenhout, Joris; Roelkens, Gunther (2015)

Low-voltage waveguide Ge APD based high sensitivity 10 Gb/s Si photonic receiver

Chen, Hongtao; Verbist, Jochem; Verheyen, Peter; De Heyn, Peter; Lepage, Guy; De Coster, Jeroen; Absil, Philippe; Yin, Xin; Bauwelinck, Johan; Van Campenhout, Joris; Roelkens, Gunther (2015-09)

Standard cell design in N7: EUV vs. immersion

Chava, Bharani; Rio, David; Sherazi, Yasser; Trivkovic, Darko; Gillijns, Werner; Debacker, Peter; Raghavan, Praveen; Elsaid, Ahmad; Dusa, Mircea; Mercha, Abdelkarim; Ryckaert, Julien; Verkest, Diederik (2015)

Time dependent variability in RMG-HKMG FinFETs: impact of extraction scheme on stochastic NBTI

Chaudhary, Ankush; Kaczer, Ben; Roussel, Philippe; Chiarella, Thomas; Horiguchi, Naoto; Mahapatra, Souvik (2015)

Challenges for line width / line edge roughness (LWR/lER) improvement in Directed Self-Assembly (DSA) advanced patterning

Chan, BT; Pathangi Sriraman, Hari; Singh, Arjun; El Otell, Ziad; Gronheid, Roel; de Marneffe, Jean-Francois; Piumi, Daniele (2015)

Conference contributions: Recent submissions

Solid composite electrolyte thin-films for lithium ion batteries

Directed self-assembly of PS-b-PMMA with ionic liquid addition

VFTLP characteristics of ESD protection diodes in advanced bulk FinFET technology

ESD characterization of gate-all-around (GAA) Si nanowire devices

Engineering of a TiN\Al2O3\(Hf,Al)O2\Ta2O5\Hf RRAM cell for fast operation at low current

Programming-conditions solutions towards suppression of retention tails of scaled oxide-based RRAM

IIIV/ hybrid integrated devices for optical interconnect

Low-voltage waveguide Ge APD based high sensitivity 10Gb/s Si photonic receiver

Sub-5V germanium waveguide avalanche photodiode based 25 Gb/s 1310 nm optical receiver

Low-voltage waveguide Ge APD based high sensitivity 10 Gb/s Si photonic receiver

Standard cell design in N7: EUV vs. immersion

Time dependent variability in RMG-HKMG FinFETs: impact of extraction scheme on stochastic NBTI

Challenges for line width / line edge roughness (LWR/lER) improvement in Directed Self-Assembly (DSA) advanced patterning

ExaShark: A scalable hybrid array kit for exascale simulation

Scanning probe tomography toward the three-dimensional characterization of confined volumes

Conductive filaments multiplicity as a variability factor in CBRAM

On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes

Copper oxide direct bonding of 200mm CMOS wafers: morphological and electrical characterization

MOVPE In1-xGaxAs high mobility channel for 3-D NAND memory

Integration and electrical evaluation of Epi-Si and Epi-SiGe channels for 3D NAND memory applications

Conference contributions: Recent submissions

Solid composite electrolyte thin-films for lithium ion batteries ﻿

Directed self-assembly of PS-b-PMMA with ionic liquid addition ﻿

VFTLP characteristics of ESD protection diodes in advanced bulk FinFET technology ﻿

ESD characterization of gate-all-around (GAA) Si nanowire devices ﻿

Engineering of a TiN\Al2O3\(Hf,Al)O2\Ta2O5\Hf RRAM cell for fast operation at low current ﻿

Programming-conditions solutions towards suppression of retention tails of scaled oxide-based RRAM ﻿

IIIV/ hybrid integrated devices for optical interconnect ﻿

Low-voltage waveguide Ge APD based high sensitivity 10Gb/s Si photonic receiver ﻿

Sub-5V germanium waveguide avalanche photodiode based 25 Gb/s 1310 nm optical receiver ﻿

Low-voltage waveguide Ge APD based high sensitivity 10 Gb/s Si photonic receiver ﻿

Standard cell design in N7: EUV vs. immersion ﻿

Time dependent variability in RMG-HKMG FinFETs: impact of extraction scheme on stochastic NBTI ﻿

Challenges for line width / line edge roughness (LWR/lER) improvement in Directed Self-Assembly (DSA) advanced patterning ﻿

ExaShark: A scalable hybrid array kit for exascale simulation ﻿

Scanning probe tomography toward the three-dimensional characterization of confined volumes ﻿

Conductive filaments multiplicity as a variability factor in CBRAM ﻿

On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes ﻿

Copper oxide direct bonding of 200mm CMOS wafers: morphological and electrical characterization ﻿

MOVPE In1-xGaxAs high mobility channel for 3-D NAND memory ﻿

Integration and electrical evaluation of Epi-Si and Epi-SiGe channels for 3D NAND memory applications ﻿

Solid composite electrolyte thin-films for lithium ion batteries

Directed self-assembly of PS-b-PMMA with ionic liquid addition

VFTLP characteristics of ESD protection diodes in advanced bulk FinFET technology

ESD characterization of gate-all-around (GAA) Si nanowire devices

Engineering of a TiN\Al2O3\(Hf,Al)O2\Ta2O5\Hf RRAM cell for fast operation at low current

Programming-conditions solutions towards suppression of retention tails of scaled oxide-based RRAM

IIIV/ hybrid integrated devices for optical interconnect

Low-voltage waveguide Ge APD based high sensitivity 10Gb/s Si photonic receiver

Sub-5V germanium waveguide avalanche photodiode based 25 Gb/s 1310 nm optical receiver

Low-voltage waveguide Ge APD based high sensitivity 10 Gb/s Si photonic receiver

Standard cell design in N7: EUV vs. immersion

Time dependent variability in RMG-HKMG FinFETs: impact of extraction scheme on stochastic NBTI

Challenges for line width / line edge roughness (LWR/lER) improvement in Directed Self-Assembly (DSA) advanced patterning

ExaShark: A scalable hybrid array kit for exascale simulation

Scanning probe tomography toward the three-dimensional characterization of confined volumes

Conductive filaments multiplicity as a variability factor in CBRAM

On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes

Copper oxide direct bonding of 200mm CMOS wafers: morphological and electrical characterization

MOVPE In1-xGaxAs high mobility channel for 3-D NAND memory

Integration and electrical evaluation of Epi-Si and Epi-SiGe channels for 3D NAND memory applications