A combined modelling approach to design test structures to study thermomigration in Cu interconnects

Ding, YouqiYouqiDingLofrano, MelinaMelinaLofranoVarela Pedreira, OlallaOlallaVarela PedreiraZahedmanesh, HoumanHoumanZahedmaneshCroes, KristofKristofCroesDe Wolf, IngridIngridDe Wolf2023-03-022022-12-302023-03-0220220026-2714WOS:000896862600013https://imec-publications.be/handle/20.500.12860/40920A combined modelling approach to design test structures to study thermomigration in Cu interconnectsJournal article10.1016/j.microrel.2022.114632WOS:000896862600013