Impact of thermal budget on junction leakage in a 0.18 μm and 0.13 μm CMOS technology

Poyai, AmpornAmpornPoyaiSimoen, EddyEddySimoenClaeys, CorCorClaeysRooyackers, RitaRitaRooyackersRedolfi, AugustoAugustoRedolfi2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6743Impact of thermal budget on junction leakage in a 0.18 μm and 0.13 μm CMOS technologyProceedings paper