Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers

Coenen, DavidDavidCoenenKim, MinkyuMinkyuKimOprins, HermanHermanOprinsBan, YoojinYoojinBanVelenis, DimitriosDimitriosVelenisVan Campenhout, JorisJorisVan CampenhoutDe Wolf, IngridIngridDe Wolf2025-02-062024-09-142025-02-0620241932-5150WOS:001283921400008https://imec-publications.be/handle/20.500.12860/44492Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceiversJournal article10.1117/1.JOM.4.1.011004WOS:001283921400008