Kennes, KoenKoenKennesPhommahaxay, AlainAlainPhommahaxayGuerrero, AliceAliceGuerreroSuhard, SamuelSamuelSuhardBex, PieterPieterBexBrems, StevenStevenBremsLiu, XiaoXiaoLiuTussing, SebastianSebastianTussingBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2022-11-212022-09-172022-11-2120220569-5503WOS:000848765300316https://imec-publications.be/handle/20.500.12860/40445Carrier Systems for Collective Die-to-Wafer BondingProceedings paper10.1109/ECTC51906.2022.00324978-1-6654-7943-1WOS:000848765300316