Electrochemical study on the mechanism of copper depostion on silicon surfaces in HF solutions

Teerlinck, IvoIvoTeerlinckGomes, W.W.GomesMertens, PaulPaulMertensHeyns, MarcMarcHeyns2021-10-142021-10-141999https://imec-publications.be/handle/20.500.12860/3875Electrochemical study on the mechanism of copper depostion on silicon surfaces in HF solutionsOral presentation