Chip-package codesign of a low-power 5-GHz RF front end

Donnay, StephaneStephaneDonnayPieters, PhilipPhilipPietersVaesen, KristofKristofVaesenDiels, WimWimDielsWambacq, P.P.WambacqDe Raedt, WalterWalterDe RaedtBeyne, EricEricBeyneEngels, MarcMarcEngelsBolsens, IvoIvoBolsens2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4347Chip-package codesign of a low-power 5-GHz RF front endJournal article