Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode

Vandevelde, BartBartVandeveldeVan Kerckhove, MatthiasMatthiasVan KerckhoveDegryse, DominiekDominiekDegryseD'Haese, WimWimD'HaeseSchaubroeck, DavidDavidSchaubroeckAllaert, BartBartAllaertGeerinckx, EddyEddyGeerinckxLauwaert, RalphRalphLauwaertWillems, GeertGeertWillems2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/23293Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull modeProceedings paper