Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

Ivankovic, AndrejAndrejIvankovicVanstreels, KrisKrisVanstreelsVanderstraeten, DanielDanielVanderstraetenBrizar, GuyGuyBrizarGillon, RenaudRenaudGillonBlansaer, EddyEddyBlansaerVandevelde, BartBartVandevelde2021-10-202021-10-2020120026-2714https://imec-publications.be/handle/20.500.12860/20853Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packagingJournal article