Buisson, ThibaultThibaultBuissonDe Preter, IngeIngeDe PreterSuhard, SamuelSamuelSuhardVandersmissen, KevinKevinVandersmissenJaenen, PatrickPatrickJaenenWitters, ThomasThomasWittersJamieson, GeraldineGeraldineJamiesonJourdain, AnneAnneJourdainVan Huylenbroeck, StefaanStefaanVan HuylenbroeckLa Manna, AntonioAntonioLa MannaBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/204053D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafersProceedings paper