Patterning of 25nm contact holes at 90nm pitch: combination of L/S double exposure immersion lithography and plasma-assisted shrink technology

de Marneffe, Jean-FrancoisJean-Francoisde MarneffeLazzarino, FredericFredericLazzarinoJohansson, HenrikHenrikJohanssonTruffert, VincentVincentTruffertBoullart, WernerWernerBoullart2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/16953Patterning of 25nm contact holes at 90nm pitch: combination of L/S double exposure immersion lithography and plasma-assisted shrink technologyMeeting abstract