Oprins, HermanHermanOprinsCherman, VladimirVladimirChermanSrinivasan, AdiAdiSrinivasanCupak, MiroslavMiroslavCupakVan der Plas, GeertGeertVan der PlasMarchal, PolPolMarchalVandevelde, BartBartVandeveldeCheng, EdmundEdmundCheng2021-10-182021-10-182010-10https://imec-publications.be/handle/20.500.12860/17742Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICsProceedings paper