Thermo mechanical challenges for processing and packaging stacked ultrathin wafers

Gonzalez, MarioMarioGonzalezVandevelde, BartBartVandeveldeLa Manna, AntonioAntonioLa MannaSwinnen, BartBartSwinnenBeyne, EricEricBeyne2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22413Thermo mechanical challenges for processing and packaging stacked ultrathin wafersProceedings paper