Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging

Kljucar, LukaLukaKljucarGonzalez, MarioMarioGonzalezCroes, KristofKristofCroesDe Wolf, IngridIngridDe WolfMurdoch, GayleGayleMurdochDe Vos, JoeriJoeriDe VosBoemmels, JuergenJuergenBoemmelsBeyne, EricEricBeyneTokei, ZsoltZsoltTokei2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26836Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packagingProceedings paper