Heterogeneously integrated InP/SOI laser using double tapered single-mode waveguides through adhesive die to wafer bonding

Lamponi, M.M.LamponiKeyvaninia, ShahramShahramKeyvaniniaPommereau, F.F.PommereauBrenot, R.R.Brenotde Valicourt, G.G.de ValicourtLelarge, F.F.LelargeRoelkens, GuntherGuntherRoelkensVan Thourhout, DriesDriesVan ThourhoutMessaoudene, S.S.MessaoudeneFedeli, J.M.J.M.FedeliDuan, G.H.G.H.Duan2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17427Heterogeneously integrated InP/SOI laser using double tapered single-mode waveguides through adhesive die to wafer bondingProceedings paper