In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures

Vanstreels, KrisKrisVanstreelsCzarnecki, PiotrPiotrCzarneckiKirimura, TomoyukiTomoyukiKirimuraSiew, Yong KongYong KongSiewDe Wolf, IngridIngridDe WolfBoemmels, JuergenJuergenBoemmelsTokei, ZsoltZsoltTokeiCroes, KristofKristofCroes2021-10-222021-10-2220140021-8979https://imec-publications.be/handle/20.500.12860/24746In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structuresJournal articlehttp://scitation.aip.org/content/aip/journal/jap/115/7/10.1063/1.4866330