Taklo, MaaikeMaaikeTakloVardĝy, Astrid-SofieAstrid-SofieVardĝyDe Wolf, IngridIngridDe WolfSimons, VeerleVeerleSimonsvan de Wiel, H.J.H.J.van de Wielvan der Waal, AdriAdrivan der WaalMartinsen, StianStianMartinsenLapadatu, AdrianaAdrianaLapadatuWunderle, BernhardBernhardWunderle2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/23148Residual stress in silicon caused by Cu-Sn wafer-level packagingMeeting abstract