Integration of the 3MS low-k CVD material in a 0.18 μm Cu single damascene process

Gao, TengTengGaoGray, WilliamWilliamGrayVan Hove, MarleenMarleenVan HoveStruyf, HerbertHerbertStruyfMeynen, HermanHermanMeynenVanhaelemeersch, SergeSergeVanhaelemeerschMaex, KarenKarenMaex2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4381Integration of the 3MS low-k CVD material in a 0.18 μm Cu single damascene processProceedings paper