Impact of backside process on high aspect ratio via-middle Cu through silicon via reliability

Li, YunlongYunlongLiVan Huylenbroeck, StefaanStefaanVan HuylenbroeckDe Vos, JoeriJoeriDe VosStucchi, MicheleMicheleStucchiCroes, KristofKristofCroesBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-242021-10-242017-06https://imec-publications.be/handle/20.500.12860/28813Impact of backside process on high aspect ratio via-middle Cu through silicon via reliabilityProceedings paperhttp://ieeexplore.ieee.org/document/7939434/