Height uniformity of micro-bumps electroplated on thin Cu seed layers

Yang, LiuLiuYangSlabbekoorn, JohnJohnSlabbekoornHonore, MiaMiaHonoreStiers, KarenKarenStiersStruyf, HerbertHerbertStruyfVereecken, PhilippePhilippeVereeckenRadisic, AlexAlexRadisic2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27624Height uniformity of micro-bumps electroplated on thin Cu seed layersProceedings paperhttp://ecst.ecsdl.org/content/72/4/145.abstract