Characterization of interconnects resulting from capillary die-to-substrate self-assembly

Mastrangeli, MassimoMassimoMastrangeliRuythooren, WouterWouterRuythoorenVan Hoof, ChrisChrisVan HoofCelis, Jean-PierreJean-PierreCelis2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14138Characterization of interconnects resulting from capillary die-to-substrate self-assemblyProceedings paper