Pre-Bond Testing Through Direct Probing of Large-Array Fine-Pitch Micro-Bumps

Marinissen, Erik JanErik JanMarinissenDe Wachter, BartBartDe WachterKiesewetter, JoergJoergKiesewetterSmith, KenKenSmith2021-10-272021-10-272019-03https://imec-publications.be/handle/20.500.12860/33540Pre-Bond Testing Through Direct Probing of Large-Array Fine-Pitch Micro-BumpsBook chapterhttps://doi.org/10.1002/9783527697052.ch11