Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs

Oprins, HermanHermanOprinsCherman, VladimirVladimirChermanTorregiani, CristinaCristinaTorregianiStucchi, MicheleMicheleStucchiVandevelde, BartBartVandeveldeBeyne, EricEricBeyne2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17743Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICsProceedings paper