Influence of Si wafer thinning processes on (Sub)surface defects

Inoue, FumihiroFumihiroInoueJourdain, AnneAnneJourdainPeng, LanLanPengPhommahaxay, AlainAlainPhommahaxayDe Vos, JoeriJoeriDe VosRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerSleeckx, ErikErikSleeckxBeyne, EricEricBeyneUedono, AkiraAkiraUedono2021-10-242021-10-2420170169-4332https://imec-publications.be/handle/20.500.12860/28563Influence of Si wafer thinning processes on (Sub)surface defectsJournal articlehttp://www.sciencedirect.com/science/article/pii/S0169433217302829