Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate

Keyvaninia, ShahramShahramKeyvaniniaMuneeb, MuhammadMuhammadMuneebStankovic, StevanStevanStankovicvan Veldhoven, P.J.P.J.van VeldhovenVan Thourhout, DriesDriesVan ThourhoutRoelkens, GuntherGuntherRoelkens2021-10-202021-10-202012-122159-3930https://imec-publications.be/handle/20.500.12860/20923Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrateJournal article