Phommahaxay, AlainAlainPhommahaxayJourdain, AnneAnneJourdainBex, PieterPieterBexVan den Eede, AxelAxelVan den EedeSwinnen, BartBartSwinnenBeyer, GeraldGeraldBeyerMiller, AndyAndyMillerBeyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/21301Evolution of temporary wafer (de)bonding technology towards low temperature processes for enhanced 3D integrationProceedings paper