Cauwe, MaartenMaartenCauweVandevelde, BartBartVandeveldeNawghane, ChinmayChinmayNawghaneVan de Slyeke, MarnixMarnixVan de SlyekeCoulon, AlexiaAlexiaCoulonHeltzel, StanStanHeltzel2023-08-022023-06-202023-08-0220231868-2502WOS:000722108500002https://imec-publications.be/handle/20.500.12860/41960Challenges in introducing high-density interconnect technology in printed circuit boards for space applicationsJournal article10.1007/s12567-021-00403-2WOS:000722108500002RELIABILITYMICROVIAS