Li, HeHeLiPannier, TinusTinusPannierGu, YeYeGuLoi, RuggeroRuggeroLoiRamaswamy, PrasannaPrasannaRamaswamySteglich, PatrickPatrickSteglichPan, BiweiBiweiPanZhang, JingJingZhangOssieur, PeterPeterOssieurRoelkens, GuntherGuntherRoelkens2026-05-072026-05-072025979-8-3315-0619-31949-2081https://imec-publications.be/handle/20.500.12860/59373We realized low-ohmic, high-speed interconnects to transfer-printed, 20 μm thick electronic chiplets with small (20 μm×20μm) pads. Spray-coated divinylsiloxane-bis-benzocyclobuten (DVS-BCB) ramps were created, onto which a lithographically defined metal redistribution layer including vias was fabricated. This approach facilitates short (low parasitic) interconnects between electronics and photonics.engProceedings paper10.1109/SiPhotonics64386.2025.10984590WOS:001556149600014