Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network

Chen, RongmeiRongmeiChenLofrano, MelinaMelinaLofranoMirabelli, GioeleGioeleMirabelliSisto, GiulianoGiulianoSistoYang, ShengShengYangJourdain, AnneAnneJourdainSchleicher, FilipFilipSchleicherVeloso, AnabelaAnabelaVelosoZografos, OdysseasOdysseasZografosWeckx, PieterPieterWeckxHiblot, GaspardGaspardHiblotVan der Plas, GeertGeertVan der PlasHellings, GeertGeertHellingsRyckaert, JulienJulienRyckaertBeyne, EricEricBeyne2023-06-012023-05-252023-06-0120222380-9248WOS:000968800700009https://imec-publications.be/handle/20.500.12860/41618Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery NetworkProceedings paper10.1109/IEDM45625.2022.10019349978-1-6654-8959-1WOS:000968800700009