Ultra-low damage integration of k= 2.3 periodic mesoporous oxide dielectric material using cryogenic etching

de Marneffe, Jean-FrancoisJean-Francoisde MarneffeZhang, LipingLipingZhangKrishtab, MikhailMikhailKrishtabGoodyear, AndyAndyGoodyearCooke, MikeMikeCookeHeylen, NancyNancyHeylenCiofi, IvanIvanCiofiWen, Liang GongLiang GongWenWilson, ChrisChrisWilsonSavage, TravisTravisSavageMatsunaga, KoichiKoichiMatsunagaNafus, KathleenKathleenNafusBoemmels, JuergenJuergenBoemmelsTokei, ZsoltZsoltTokeiBaklanov, MikhaïlMikhaïlBaklanov2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/23709Ultra-low damage integration of k= 2.3 periodic mesoporous oxide dielectric material using cryogenic etchingMeeting abstract