Mechanical and chemical adhesion at the encapsulant interfaces during the lamination of photovoltaic modules

Nivelle, PhilippePhilippeNivelleBorgers, TomTomBorgersVoroshazi, EszterEszterVoroshaziPoortmans, JefJefPoortmansD'Haen, JanJanD'HaenDe Ceuninck, WardWardDe CeuninckDaenen, MichaëlMichaëlDaenen2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/31426Mechanical and chemical adhesion at the encapsulant interfaces during the lamination of photovoltaic modulesProceedings paperhttps://ieeexplore.ieee.org/document/8353630/