A quantitative study of the adhesion between copper, barrier and organic low-k polymers

Lanckmans, FilipFilipLanckmansBrongersma, SywertSywertBrongersmaVarga, IstvanIstvanVargaBender, HugoHugoBenderBeyne, EricEricBeyneMaex, KarenKarenMaex2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5428A quantitative study of the adhesion between copper, barrier and organic low-k polymersProceedings paper