Development and evaluation of a-SiCO:H films as Cu and moisture diffusion barriers with a low dielectric constant, for advanced interconnects

Van Besien, ElsElsVan BesienSingh, ArjunArjunSinghBarbarin, YohanYohanBarbarinVerdonck, PatrickPatrickVerdonckBaklanov, MikhaïlMikhaïlBaklanov2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/23221Development and evaluation of a-SiCO:H films as Cu and moisture diffusion barriers with a low dielectric constant, for advanced interconnectsMeeting abstract