Oprins, HermanHermanOprinsCherman, VladimirVladimirChermanRebibis, Kenneth JuneKenneth JuneRebibisVermeersch, KristinaKristinaVermeerschGerets, CarineCarineGeretsVandevelde, BartBartVandeveldeLa Manna, AntonioAntonioLa MannaBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-202021-10-202012-05https://imec-publications.be/handle/20.500.12860/21234Transient analysis based thermal characterization of die-die interfaces in 3D-ICsProceedings paper