Yang, LiuLiuYangAtanasova, TanyaTanyaAtanasovaRadisic, AlexAlexRadisicDeconinck, JohanJohanDeconinckWest, AlanAlanWestVereecken, PhilippePhilippeVereecken2021-10-212021-10-2120130013-4686https://imec-publications.be/handle/20.500.12860/23417Wafer-scale Cu plating uniformity on thin Cu seed layersJournal articlehttp://dx.doi.org/10.1016/j.electacta.2013.04.094