Chen, JianJianChenHo, MengMengHoLam, Kan WaiKan WaiLamRatchev, PetarPetarRatchevStoukatch, SergueiSergueiStoukatchBeyne, EricEricBeyneVath, C.J.C.J.VathDe Wolf, IngridIngridDe Wolf2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6102Bonding on Cu: a new stress evaluation approach by Raman spectroscopyProceedings paper