Sheng, L. Y.L. Y.ShengDe Tandt, CathleenCathleenDe TandtRanson, WillyWillyRansonVounckx, RogerRogerVounckx2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4741Reliability characterization of thermal micro-structures implemented on 0.8 mu m CMOS chipsProceedings paper