Packaging solution with a 3-dimensional coupling scheme for direct optical interconnects to the chip

Rits, OlivierOlivierRitsBockstaele, RonnyRonnyBockstaeleBaets, RoelRoelBaets2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/9512Packaging solution with a 3-dimensional coupling scheme for direct optical interconnects to the chipProceedings paper