Beyne, EricEricBeyneIker, FrancoisFrancoisIkerSoussan, PhilippePhilippeSoussanFunaya, TakuoTakuoFunayaVanfleteren, JanJanVanfleterenCotrin Teixeira, RicardoRicardoCotrin TeixeiraTorfs, TomTomTorfsChristiaens, WimWimChristiaens2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13390High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technologyProceedings paper