Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction Loading

Kljucar, LukaLukaKljucar2021-10-242021-10-242017-12https://imec-publications.be/handle/20.500.12860/28690Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction LoadingPHD thesishttps://limo.libis.be/primo-explore/fulldisplay?docid=LIRIAS1941849&context=L&vid=Lirias&search_scope=Lirias&tab=default_tab&lang=en_US&fromSitemap=1