Balachandran, JayaprakashJayaprakashBalachandranBrebels, StevenStevenBrebelsCarchon, GeertGeertCarchonDe Raedt, WalterWalterDe RaedtNauwelaers, BartBartNauwelaersBeyne, EricEricBeyne2021-10-162021-10-162005-06https://imec-publications.be/handle/20.500.12860/10054Packaging approach for nano-CMOS wiringProceedings paper