Integration of passive components in thin film multilayer MCM-D technology for wireless front-end applications

Pieters, PhilipPhilipPietersVaesen, KristofKristofVaesenCarchon, GeertGeertCarchonBrebels, StevenStevenBrebelsDe Raedt, WalterWalterDe RaedtBeyne, EricEricBeyne2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4660Integration of passive components in thin film multilayer MCM-D technology for wireless front-end applicationsProceedings paper