Seed layer and multistack approaches to reduce leakage in SrTiO3-based metal-insulator-metal capacitors using TiN bottom electrode

Menou, NicolasNicolasMenouPopovici, Mihaela IoanaMihaela IoanaPopoviciOpsomer, KarlKarlOpsomerKaczer, BenBenKaczerPawlak, MalgorzataMalgorzataPawlakAdelmann, ChristophChristophAdelmannFranquet, AlexisAlexisFranquetFavia, PaolaPaolaFaviaBender, HugoHugoBenderDetavernier, ChristopheChristopheDetavernierVan Elshocht, SvenSvenVan ElshochtWouters, DirkDirkWoutersBiesemans, SergeSergeBiesemansKittl, JorgeJorgeKittl2021-10-182021-10-1820100021-4922https://imec-publications.be/handle/20.500.12860/17618Seed layer and multistack approaches to reduce leakage in SrTiO3-based metal-insulator-metal capacitors using TiN bottom electrodeJournal article