Tbps/mm bandwidth for chip-to-chip communication using fine pitch damascene RDL

Pantano, NicolasNicolasPantanoSlabbekoorn, JohnJohnSlabbekoornVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2022-01-242021-11-022022-01-242022-01-242020naWOS:000631824100054https://imec-publications.be/handle/20.500.12860/38042Tbps/mm bandwidth for chip-to-chip communication using fine pitch damascene RDLProceedings paper978-1-7281-6293-5WOS:000631824100054