Copper rich Cu1-xNix alloys (0.05 < x < 0.15) electrodeposited from acid sulfate-based electrolyte with benzotriazole additive for microbump metallization for 3D stacked integrated circuits

Haesevoets, KarelKarelHaesevoetsRadisic, AlexAlexRadisicVereecken, PhilippePhilippeVereecken2021-10-272021-10-2720190013-4651https://imec-publications.be/handle/20.500.12860/33079Copper rich Cu1-xNix alloys (0.05 < x < 0.15) electrodeposited from acid sulfate-based electrolyte with benzotriazole additive for microbump metallization for 3D stacked integrated circuitsJournal articlehttp://jes.ecsdl.org/lookup/doi/10.1149/2.0721908jes